[pro-see-yon]
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Plating vias/holes: Plating is accomplished by using a reverse pulse plate technology. This provides a uniform copper plating, even for the more difficult aspect ratios and smaller holes. This system helps eliminate the “bone effect” that can clog up small vias. Plating will add 17um to walls of holes. Please ensure that your holes will be large enough to accommodate through-hole parts after plating. Hidden Vias: Hidden vias (blind vias) are supported only in the four, six or eight layer prototypes. A four layer board may have hidden vias only between layers 2-3. A six layer prototype board can have hidden vias between layers 3-4 & 2-5. An eight layer prototype board may have hidden vias between layers 4-5, 3-6, & 2-7. All boards can have through-plated holes from top to bottom layers using the standard *.ncd format. All via/holes must be in the *.ncd format. All vias and drilled holes will be plated unless otherwise instructed with a separate *.ncd type file for unplated holes. Edge Plating: Edge plating can be done on a special request (with limitations). * All Multilayer PCB's must not use any hole size less than 0.25 mm.
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