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Board Materials PCB Requirements File Extensions Shipping/Receiving Definition
 

 

***Please download the following *.pdf files to properly export your files so that we may read your Gerber data correctly.***
For Exporting Eagle, OrCad, PCad, & Protel click here:
LPKF_DOCUMENTS
 

Listed below are links to File Extensions, Board Size, Routing & Slot Outlines, Plating, Drill Sizes, Multilayer, Silk Screen, Solder Mask, Cut-Line, & Hidden/Blind Vias pages that explain what we can do.

Line traces, pads/vias should be as large as possible when designing a prototype board. Please use a DRC to verify that you have a minimum of 4 mils between traces and pads. Anything smaller than 4 mils will not be cut away and therefore shorted together. We support any SMT component with a minimum spacing between leads of 4 mils with a clearance of 4 mils. A minimum of 5 mils of copper should be left around via and plated holes to prevent the lifting of the copper from the substrate. This is very important when using any Teflon material due to the adhesion issues.

***It is extremely important that all jobs include a "Aperture List (*.APR) File" in text format.

***It is extremely important that all job requests include a simple "Read Me" file in a text format to explain all layers and any comments that are necessary from the designer. Please include in the text file any information relevant to the job request. Example:  DXF files, all layers are assigned to a single layer and must be copied to individual layers. This information will save time and cost to the customer. The customer should designate which items are assigned to any or all specific layers (PADS - Top & Bottom Layers, VIAS, PADS TOP - Top Layer Only, PADS BOTTOM - Bottom Layer Only, etc.....)

***Please ensure that when exporting out any format files to please verify that all layers are oriented in the same manner, as if viewing from the top layer looking down through to the bottom layer.***

Board Outlines:

All requested prototype boards must have board outlines. We will cut the board outline as a Zero width line using a contour router to cut on the outside edge of the outline.

Planes:

Ground, and Power planes should be sent as a negative image files. We can work with positive images, but we prefer negative files. Please do not combine positive and negative image files on the same layer.

We accept data in the following formats:

            ODB++  PREFERRED DATA ACCEPTED
           
GerberX (RS 274-X) PREFERRED DATA ACCEPTED
           
Gerber
            HP-GL
            Excellon
            Sieb & Meier
            DXF
            DPF (Barco)
           

Drill Files: Please provide *.ncd format for drill files (for each set of plated & unplated holes). Otherwise you will need to provide detailed drawing files with exported EXCELLON data. Please specify on the RFQ which format you are providing.

File Extensions

Files needed to produce prototype pcb's.

Board Size

Limitations on prototype board size.

Routing & Slot Outlines

Contour routing and slots.

Plating Vias and Holes

Description our plating process.

Drill Sizes

          Describes the 29 different choices for hole size from 0.2mm - 1.9mm and larger

Multilayer Prototypes
 
        Describes the material we use for multilayer prototypes.
 
Silk Screen
 
       Procyon PCB Inc. offers a White LPI Legend.

Solder Mask

       Procyon PCB Inc. offers a dark Green LPI Legend, as well as our polyimide coverlay material.

Cut-Line Prototypes 
 
An inexpensive solution to learn how a microelectronic device operates....

Hidden/Blind Vias
 
Specifies which layers can have hidden or blind vias.
 

 

Home File Extensions Board Size Drill Sizes Routing & Slot Outlines Plating Vias/Holes Multilayer Prototypes Silk Screen Solder Mask Cut-Line Prototypes Hidden/Blind ViasBoard Materials PCB Requirements File Extensions Shipping/Receiving Definition

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Last modified: 08/21/06